Microsoft revealed some more details and specifications about their augmented and virtual reality headset, HoloLens.
It is now available to pre-order for $3,000, however, before you go out and do that you should read this news about the specifications for the HoloLens.
These details were revealed by Nick Baker, the devices engineer at Microsoft during the Hot Chips conference in California this week.
During the event, he revealed what’s inside of the HPU and how powerful the processing unit is.
The Register wrote the following about what he revealed:
The secretive HPU is a custom-designed TSMC-fabricated 28nm coprocessor that has 24 Tensilica DSP cores. It has about 65 million logic gates, 8MB of SRAM, and a layer of 1GB of low-power DDR3 RAM on top, all in a 12mm-by-12mm BGA package. We understand it can perform a trillion calculations a second.
It handles all the environment sensing and other input and output necessary for the virtual-reality goggles. It aggregates data from sensors and processes the wearer’s gesture movements, all in hardware so it’s faster than the equivalent code running on a general purpose CPU. Each DSP core is given a particular task to focus on.
The unit sits alongside a 14nm Intel Atom x86 Cherry Trail system-on-chip, which has its own 1GB of RAM and runs Windows 10 and apps that take advantage of the immersive noggin-fitted display.
Via: The Register